The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Dec. 13, 2013
Honda Motor Co., Ltd., Minato-ku, Tokyo, JP;
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Hiroshi Otsuka, Wako, JP;
Tomohiro Fukazu, Wako, JP;
Kosuke Nishiyama, Wako, JP;
Takeshi Ichimura, Matsumoto, JP;
Hiromichi Gohara, Matsumoto, JP;
HONDA MOTOR CO., LTD., Tokyo, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
A semiconductor module cooler includes a fin which is a heat sink, which is thermally connected to a semiconductor element, and which has one or more notches in an edge at one or more arbitrary positions in a longitudinal direction and one or more convex ribs which are formed on a bottom of a water jacket having a cooling flow path and which fit into the one or more notches at one or more arbitrary positions. By doing so, the efficiency of transferring heat generated by the semiconductor element by a coolant is improved and cooling performance is improved.