The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Apr. 29, 2013
Applicant:

Sinmat, Inc., Gainesville, FL (US);

Inventors:

Rajiv K. Singh, Newberry, FL (US);

Arul Chakkaravarthi Arjunan, Gainesville, FL (US);

Assignees:

Sinmat, Inc., Gainesville, FL (US);

University of Florida Research Foundation, Inc., Gainesville, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); C30B 25/18 (2006.01); C30B 29/36 (2006.01); H01L 21/306 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0201 (2013.01); C30B 25/186 (2013.01); C30B 29/36 (2013.01); H01L 21/0237 (2013.01); H01L 21/0254 (2013.01); H01L 21/02378 (2013.01); H01L 21/02389 (2013.01); H01L 21/02439 (2013.01); H01L 21/02458 (2013.01); H01L 21/02521 (2013.01); H01L 21/02529 (2013.01); H01L 21/02639 (2013.01); H01L 21/02647 (2013.01); H01L 21/30608 (2013.01); H01L 21/30617 (2013.01); H01L 21/30625 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01);
Abstract

A method for forming an epitaxial layer on a substrate surface having crystalline defect or amorphous regions and crystalline non-defect regions includes preferential polishing or etching the crystalline defect or amorphous regions relative to the crystalline non-defect regions to form a decorated substrate surface having surface recess regions. A capping layer is deposited on the decorated substrate surface to cover the crystalline non-defect regions and to at least partially fill the surface recess regions. The capping layer is patterned by removing the capping layer over the crystalline non-defect regions to form exposed non-defect regions while retaining the capping layer in at least a portion of the surface recess regions. Selective epitaxy is then used to form the epitaxial layer, wherein the capping layer in the surface recess regions restricts epitaxial growth of the epitaxial layer over the surface recess regions.


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