The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Oct. 16, 2009
Linda Yi-ping Zhu, Shanghai, CN;
Wanglin Yu, Midland, MI (US);
Fang LI, Shanghai, CN;
Daniel A. Aguilar, Lake Jackson, TX (US);
David B. Wurm, Pearland, TX (US);
Linda Yi-Ping Zhu, Shanghai, CN;
Wanglin Yu, Midland, MI (US);
Fang Li, Shanghai, CN;
Daniel A. Aguilar, Lake Jackson, TX (US);
David B. Wurm, Pearland, TX (US);
Dow Global Technologies LLC, Midland, MI (US);
Abstract
Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.