The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
May. 14, 2014
Applicants:
Zhigang Bai, Tianjin, CN;
Zhijie Wang, Tianjin, CN;
Jinzhong Yao, Tianjin, CN;
Inventors:
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 23/3107 (2013.01); H01L 21/4842 (2013.01); H01L 23/49541 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/85 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);
Abstract
A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.