The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Sep. 29, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Guido Boenig, Warstein, DE;
Olaf Hohlfeld, Warstein, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/24 (2006.01); H01L 23/053 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/053 (2013.01); H01L 23/16 (2013.01); H01L 24/48 (2013.01); H01L 23/24 (2013.01); H01L 2224/48096 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing has a housing side wall. The bond wire is arranged in the module housing. At least a section of the first sound absorber is arranged between the semiconductor chip and the housing side wall.