The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Jan. 10, 2014
Applicants:
Kee Cheong Fam, Kuala Lumpur, MY;
Mohd Rusli Ibrahim, Shah Alam, MY;
Lan Chu Tan, Singapore, SG;
Inventors:
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 29/84 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 24/83 (2013.01); H01L 29/84 (2013.01); H01L 2924/11 (2013.01); H01L 2924/181 (2013.01);
Abstract
A pressure sensor device includes a gel retainer that is mounted or formed on a substrate. The gel retainer has a cavity and a pressure sensing die is mounted inside the cavity. The die is electrically connected to one or more other package elements. A pressure-sensitive gel material is dispensed into the cavity to cover an active region of the pressure sensing die. A mold compound is applied on an upper surface of the substrate outside of the gel retainer.