The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

May. 06, 2014
Applicant:

Sandisk 3d Llc, Milpitas, CA (US);

Inventors:

Mark G. Johnson, Los Altos, CA (US);

Thomas H. Lee, Cupertino, CA (US);

Vivek Subramanian, Menlo Park, CA (US);

Paul Michael Farmwald, Portola Valley, CA (US);

James M. Cleeves, Redwood, CA (US);

Assignee:

SanDisk 3D LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/36 (2006.01); G11C 17/06 (2006.01); G11C 11/56 (2006.01); G11C 13/00 (2006.01); G11C 17/14 (2006.01); G11C 17/16 (2006.01); H01L 27/10 (2006.01); H01L 27/102 (2006.01); H01L 45/00 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
G11C 17/06 (2013.01); G11C 11/5692 (2013.01); G11C 13/003 (2013.01); G11C 17/14 (2013.01); G11C 17/16 (2013.01); G11C 17/165 (2013.01); H01L 27/101 (2013.01); H01L 27/1021 (2013.01); H01L 27/2481 (2013.01); H01L 45/1233 (2013.01); H01L 45/16 (2013.01); G11C 2213/71 (2013.01); G11C 2213/76 (2013.01);
Abstract

A three-dimensional memory is provided that includes a first memory level and a second memory level monolithically formed above the first memory level. The first memory level includes a first steering element coupled in series with and vertically stacked above or below a first non-volatile state change element. The second memory level includes a second steering element coupled in series with and vertically stacked above or below a second non-volatile state change element. Other aspects are also provided.


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