The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Jul. 31, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ulrich Schmid, Vienna, AT;

Tobias Frischmuth, Vienna, AT;

Peter Irsigler, Obernberg/Inn, AT;

Thomas Grille, Villach, AT;

Daniel Maurer, Feld am See, AT;

Ursula Hedenig, Villach, AT;

Markus Kahn, Rangersdorf, AT;

Guenter Denifl, Annenheim, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 3/0013 (2013.01); B81B 3/0037 (2013.01); B81C 1/00674 (2013.01); B81B 2201/0257 (2013.01);
Abstract

A micro mechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure further includes a conductive base layer having a conductive base layer material. The conductive base layer material includes sectionally in a stiffening section a carbon material such that a carbon concentration of the carbon material in the conductive base layer material is at least 1014 per cubic cm and at least higher by a factor of 103 than in the conductive base layer material adjacent to the stiffening section.


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