The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Feb. 21, 2012
Applicants:

Erkan Koparal, Nidderau, DE;

Andreas Kloeppel, Glauburg, DE;

Inventors:

Erkan Koparal, Nidderau, DE;

Andreas Kloeppel, Glauburg, DE;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C 13/00 (2006.01); B05D 7/00 (2006.01); C23C 14/56 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
B05C 13/00 (2013.01); B05D 7/56 (2013.01); C23C 14/568 (2013.01); H01L 21/6776 (2013.01); H01L 21/67173 (2013.01); H01L 21/67712 (2013.01);
Abstract

A substrate processing system for processing an essentially vertically oriented substrate is described. The system includes a first processing chamber having a first processing region to deposit a first layer comprising a first material, a second processing chamber having a second processing region to deposit a second layer over the first layer, the second layer comprising a second material, a third processing chamber having a third processing region to deposit a layer comprising the second material, a transfer chamber providing essentially linear transport paths with the first, second, and third chambers, respectively, and a chamber comprising a first and a second transportation track, wherein at least one of the first and second transportation tracks forms an essentially linear transportation path with the first processing chamber, wherein the first chamber is adapted to receive the substrate from the transfer chamber, and to deposit a further layer comprising the first material.


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