The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

May. 18, 2012
Applicant:

Cheng-po Yu, Taoyuan County, TW;

Inventor:

Cheng-Po Yu, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0035 (2013.01); H05K 3/465 (2013.01); H05K 3/107 (2013.01); H05K 2201/0236 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/1476 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A manufacturing method of an embedded wiring board is provided. The method includes the following steps. First, an insulation layer and a lower wiring layer are provided, wherein the insulation layer includes a polymeric material. Then, the plural catalyst grains are distributed in the polymeric material. A groove and an engraved pattern are formed on the upper surface. A blind via is formed on a bottom surface of the groove to expose the lower pad. An upper wiring layer is formed in the engraved pattern. Some catalyst grains are exposed and activated in the groove, the engraved pattern and the blind via. A first conductive pillar is formed in the groove. Finally, a second conductive pillar is formed in the blind via.


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