The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Mar. 15, 2013
Applicant:
Infineon Technologies Dresden Gmbh, Dresden, DE;
Inventors:
Thoralf Kautzsch, Dresden, DE;
Heiko Froehlich, Radebeul, DE;
Mirko Vogt, Dresden, DE;
Maik Stegemann, Pesterwitz, DE;
Thomas Santa, Seeboden, AT;
Markus Burian, Villach, AT;
Assignee:
Infineon Technologies Dresden GmbH, Dresden, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/24 (2006.01); H03H 9/02 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H03H 3/007 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02259 (2013.01); B81B 3/0078 (2013.01); H03H 9/2452 (2013.01); B81B 2201/0271 (2013.01); B81C 1/00158 (2013.01); B81C 1/00246 (2013.01); B81C 1/00396 (2013.01); B81C 2203/0145 (2013.01); H03H 3/0073 (2013.01); H03H 9/2463 (2013.01); H03H 2009/0233 (2013.01); H03H 2009/02291 (2013.01); H03H 2009/02307 (2013.01); H03H 2009/02496 (2013.01);
Abstract
Embodiments relate to MEMS resonator structures and methods that enable application of a maximum available on-chip voltage. In an embodiment, a MEMS resonator comprises a connection between a ground potential and the gap electrode of the resonator. Embodiments also relate to manufacturing systems and methods that are less complex and enable production of MEMS resonators of reduced dimensions.