The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Apr. 23, 2007
Roland Rupp, Lauf, DE;
Stefan Woehlert, Villach, AT;
Thomas Gutt, Hohenbrunn, DE;
Michael Treu, Villach, AT;
Roland Rupp, Lauf, DE;
Stefan Woehlert, Villach, AT;
Thomas Gutt, Hohenbrunn, DE;
Michael Treu, Villach, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing a device comprises depositing one or more metallization layers to a substrate, locally heating an area of the one or more metallization layers to obtain a substrate/metallization-layer compound or a metallization-layer compound, the compound comprising an etch-selectivity toward an etching medium which is different to that of the one or more metallization layers outside the area, and removing the one or more metallization layers in the area or outside the area, depending on the etching selectivity in the area or outside the area, by etching with the etching medium to form the device.