The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Mar. 16, 2011
Applicants:

Naoki Morimoto, Shizuoka, JP;

Masahiko Ishida, Shizuoka, JP;

Inventors:

Naoki Morimoto, Shizuoka, JP;

Masahiko Ishida, Shizuoka, JP;

Assignee:

ULVAC, INC., Kanagawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/54 (2006.01); C23C 14/50 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3438 (2013.01); C23C 14/34 (2013.01); C23C 14/345 (2013.01); C23C 14/3492 (2013.01); C23C 14/542 (2013.01); C23C 14/50 (2013.01); H01J 37/3405 (2013.01);
Abstract

A sputtering apparatus includes: a vacuum chamber in which a target is to be disposed; a power supply to input power to the target; gas introduction device; exhaust device; and substrate holding device to hold a substrate to be processed. The substrate holding device includes: a chuck main body having positive and negative electrodes; a chuck plate having a rib portion capable of bringing a peripheral edge portion of the substrate into surface contact with the rib portion; and a multiplicity of supporting portions provided upright and arranged at predetermined intervals in an interior space surrounded by the rib portion; and a DC power supply to apply a direct voltage between the two electrodes. The sputtering apparatus suppresses a variation in film thickness among substrates.


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