The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9207258 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 08, 2015

Filed:

Sep. 28, 2012
Applicants:

David Shia, Portland, OR (US);

Todd P. Albertson, Warren, OR (US);

Kip P. Stevenson, Portland, OR (US);

Inventors:

David Shia, Portland, OR (US);

Todd P. Albertson, Warren, OR (US);

Kip P. Stevenson, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 31/26 (2014.01); G01R 3/00 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06761 (2013.01); G01R 3/00 (2013.01); G01R 31/2886 (2013.01);
Abstract

An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core. Between 10 to 30% of the outer cross-sectional dimension is provided by the low electrical resistivity layer.


Find Patent Forward Citations

Shia, David. (2015). Composite wire probes for testing integrated circuits (U.S. Patent No. 9207258). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9207258

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