The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Mar. 08, 2013
Applied Materials, Inc., Santa Clara, CA (US);
Kun Xu, Sunol, CA (US);
Shih-Haur Shen, Sunnyvale, CA (US);
Tzu-Yu Liu, San Jose, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Hassan G. Iravani, San Jose, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Doyle E. Bennett, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of chemical mechanical polishing a substrate includes polishing a layer on the substrate at a polishing station, monitoring the layer during polishing at the polishing station with an in-situ monitoring system, the in-situ monitoring system monitoring an elongated region and generating a measured signal, computing an angle between a primary axis of the elongated region and a tangent to an edge of the substrate, modifying the measured signal based on the angle to generate a modified signal, and at least one of detecting a polishing endpoint or modifying a polishing parameter based on the modified signal.