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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9203146 B1

PDFFull Text
Date of Patent:
Dec. 01, 2015

Filed:

Feb. 05, 2014

Antenna using through-silicon via

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hsiao-Tsung Yen, Tainan, TW;

Jhe-Ching Lu, Tainan, TW;

Yu-Ling Lin, Taipei, TW;

Chin-Wei Kuo, Zhubei, TW;

Min-Chie Jeng, Taipei, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., , TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Seung Lee

Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/50 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 9/14 (2006.01); G06F 17/50 (2006.01); H01L 25/07 (2006.01); H01Q 5/357 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/50 (2013.01); G06F 17/5068 (2013.01); H01L 23/48 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01L 25/074 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 5/357 (2015.01); H01Q 9/0421 (2013.01); H01Q 9/0442 (2013.01); H01Q 9/145 (2013.01); H01L 23/481 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10333 (2013.01); H01L 2924/10335 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/49016 (2015.01);
Abstract

An antenna includes a substrate and a conductive top plate over the substrate. A feed line is connected to the top plate, and the feed line comprises a first through-silicon via (TSV) structure passing through the substrate. The feed line is arranged to carry a radio frequency signal. A method of designing an antenna includes selecting a shape of a top plate, determining a size of the top plate based on an intended signal frequency, and determining, based on the shape of the top plate, a location of each TSV of at least one TSV contacting the top plate. A method of implementing an antenna includes forming a first feed line through a substrate, the first feed line comprising a TSV, and forming a top plate over the substrate, the top plate being electrically conductive and connected to the first feed line.

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