The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9202795 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 01, 2015

Filed:

Jun. 21, 2012
Applicants:

Takashi Oda, Ibaraki, JP;

Naohide Takamoto, Ibaraki, JP;

Hiroyuki Senzai, Ibaraki, JP;

Inventors:

Takashi Oda, Ibaraki, JP;

Naohide Takamoto, Ibaraki, JP;

Hiroyuki Senzai, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); C09J 7/02 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); C09J 7/0239 (2013.01); H01L 24/29 (2013.01); H01L 25/0657 (2013.01); C09J 2201/36 (2013.01); C09J 2201/606 (2013.01); C09J 2201/61 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); H01L 23/29 (2013.01); H01L 23/3114 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/8191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/15787 (2013.01); Y10T 428/2826 (2015.01);
Abstract

Provided is a laminated film wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The laminated film of the present invention is a laminated film for filling the space between semiconductor elements that are electrically connected through a member or connection, the film including a dicing sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a curable film that is laminated on the pressure-sensitive adhesive layer, wherein the curable film has a lowest melt viscosity at 50 to 200° C. of 1×10Pa·s or more and 1×10Pa·s or less.


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