The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Mar. 09, 2009
Takamitsu Tomiga, Shizuoka-ken, JP;
Tomoo Kato, Shizuoka-ken, JP;
Tadashi Inaba, Shizuoka-ken, JP;
Masaru Yoshikawa, Shizuoka-ken, JP;
Takamitsu Tomiga, Shizuoka-ken, JP;
Tomoo Kato, Shizuoka-ken, JP;
Tadashi Inaba, Shizuoka-ken, JP;
Masaru Yoshikawa, Shizuoka-ken, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
A liquid for polishing a metal is provided that is used for chemically and mechanically polishing a conductor film including copper or a copper alloy in production of a semiconductor device, and a polishing method using the metal-polishing liquid is also provided. The liquid includes: (a) colloidal silica particles having an average primary particle size of from 10 nm to 25 nm and an average secondary particle size of from 50 nm to 70 nm; (b) a metal anticorrosive agent; (c) at least one compound selected from the group consisting of a surfactant and a water-soluble polymer compound; (d) an oxidizing agent; and (e) an organic acid.