The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Apr. 07, 2009
Applicants:

Gautam Banerjee, Chandler, AZ (US);

Timothy Frederick Compton, Casa Grande, AZ (US);

Junaid Ahmed Siddiqui, Richmond, VA (US);

Ajoy Zutshi, Chandler, AZ (US);

Inventors:

Gautam Banerjee, Chandler, AZ (US);

Timothy Frederick Compton, Casa Grande, AZ (US);

Junaid Ahmed Siddiqui, Richmond, VA (US);

Ajoy Zutshi, Chandler, AZ (US);

Assignee:

Air Products and Chemicals, Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C09G 1/02 (2006.01); C11D 7/34 (2006.01); C11D 11/00 (2006.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C11D 7/34 (2013.01); C11D 11/0047 (2013.01); H01L 21/02074 (2013.01); H01L 21/3212 (2013.01); H01L 21/32125 (2013.01);
Abstract

A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, benzenesulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords tunability of removal rates for metal, barrier layer materials, and dielectric layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).


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