The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Nov. 22, 2013
Amkor Technology, Inc., Chandler, AZ (US);
Doo Hyun Park, Gyeonggi-do, KR;
Seong Min Seo, Seoul, KR;
Seok Woo Yun, Seoul, KR;
Ji Hun Lee, Seoul, KR;
Seo Yeon Ahn, Chungcheongbuk-do, KR;
Young Rae Kim, Seoul, KR;
Jong Sik Paek, Gyeonggi-do, KR;
Abstract
Various aspects of the present disclosure provide a semiconductor device and a method for manufacturing thereof, which can facilitate stacking of semiconductor die while saving manufacturing cost. In an example embodiment, the semiconductor device may comprise a first semiconductor die, a second semiconductor die bonded to a top surface of the first semiconductor die, and a redistribution layer electrically connecting the first semiconductor die to the second semiconductor die, wherein the redistribution layer is formed to extend along surrounding side portions of the second semiconductor die.