The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Jan. 10, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Edward C. Cooney, III, Jericho, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Richard S. Graf, Gray, ME (US);
Gary L. Milo, Milton, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/58 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2223/5446 (2013.01);
Abstract
Various embodiments include managing metal densities in kerf sections of an integrated circuit (IC) wafer. In some embodiments, a method includes: forming an integrated circuit (IC) wafer including a wafer kerf region, the wafer kerf region having a metal density of less than approximately 0.5 percent relative to a total density of the wafer kerf region.