The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Mar. 18, 2013
Applicant:
Xintec Inc., Jhongli, TW;
Inventors:
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); B81C 1/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); B81C 1/00269 (2013.01); B81C 1/00357 (2013.01); B81C 3/001 (2013.01); H01L 21/50 (2013.01); B81C 2201/019 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A stacked wafer structure includes a substrate; dams provided on the substrate and having protrusions on a surface thereof; and a wafer with recesses provided on the dam. The protrusions on the surface of the dams are wedged into the recesses of the wafer, preventing air chambers from forming between the recesses of the wafer and the dams, so that the wafer is not separated from the dams due to the presence of air chambers during subsequent packaging process. A method for stacking a wafer is also provided.