The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Dec. 04, 2013
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventor:
Kuang-Hui Tang, Kaohsiung, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); H01L 24/05 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/13 (2013.01); H01L 2223/5444 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/13027 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/16106 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/94 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A package structure is disclosed. The package structure includes a die; a substrate disposed corresponding to the die, wherein the substrate comprises a first dummy pad and a second dummy pad on a first surface of the substrate; and a first solder ball and a second solder ball on a second surface of the substrate and electrically connect the first dummy pad and the second dummy pad respectively.
Tang, Kuang-Hui. (2015). Method for generating die identification by measuring whether circuit is established in a package structure (U.S. Patent No. 9196549). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9196549
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile