The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Mar. 14, 2014
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823807 (2013.01); H01L 29/66477 (2013.01); H01L 29/7841 (2013.01); H01L 29/7847 (2013.01);
Abstract
Integrated circuits with selectively stressed semiconductor-on-insulator (SOI) body contacts and methods for fabricating integrated circuits with selectively stressed SOI body contacts are provided. An exemplary method for fabricating an integrated circuit includes forming a channel region and a body contact overlying and/or in an SOI substrate. Further, the method includes selectively applying a first stress to the source/drain region in a longitudinal direction. Also, the method includes selectively applying a second stress to the body contact in a lateral direction perpendicular to the longitudinal direction.