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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9196539 B1

PDFFull Text
Date of Patent:
Nov. 24, 2015

Filed:

Sep. 02, 2014

Method for separating and transferring ic chips

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masahiro Yamada, Boise, ID (US);

Kenya Iwasaki, Tokyo, JP;

Hiroshi Nishikawa, Tokyo, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Angel Roman

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/82 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 25/065 (2006.01); H01L 21/66 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82 (2013.01); H01L 21/3065 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 25/0657 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06568 (2013.01);
Abstract

A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed is provided. The method includes forming a mask pattern on a surface of the wafer, and separating each of the semiconductor devices or semiconductor integrated circuits along the mask pattern formed on the surface of the wafer. The mask pattern is a repeated pattern without having a lattice line shape, and the step of separating each of the semiconductor devices or semiconductor integrated circuits is performed by plasma etching.

Find Patent Forward Citations

Yamada, Masahiro. (2015). Method for separating and transferring ic chips (U.S. Patent No. 9196539). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9196539

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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