The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Aug. 01, 2014
Freescale Semiconductor, Inc., Austin, TX (US);
Audel A. Sanchez, Tempe, AZ (US);
Michael L. Eleff, Phoenix, AZ (US);
Jose L. Suarez, Chandler, AZ (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
Systems and methods for releasing semiconductor dies from an adhesive tape or film. In some embodiments, a semiconductor manufacturing device may include: a chuck plate configured to support an array of semiconductor dies, where each die in the array has a top surface and a bottom surface, where each die's bottom surface is bonded to an adhesive tape, and where the chuck plate comprises one or more channels configured to apply a negative pressure to the adhesive tape; and a tape release element having an irregular surface, the tape release element disposed between the chuck plate and the adhesive tape.