The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Aug. 12, 2014
Applicant:
Roy C. Nangoy, Santa Clara, CA (US);
Inventor:
Roy C. Nangoy, Santa Clara, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01J 37/32568 (2013.01); H01J 37/32642 (2013.01); H01L 21/673 (2013.01); H01L 21/67069 (2013.01); H01L 21/67207 (2013.01); H01L 21/6831 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01J 2237/002 (2013.01); H01J 2237/024 (2013.01); H01J 2237/334 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/5446 (2013.01);
Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma processing apparatus includes a processing chamber having a chamber wall. The plasma processing apparatus also includes a plasma source in an upper portion of the processing chamber. A sample support is included for situating a sample below the plasma source. An actively-cooled shadow ring having a cooling channel therein for cooling fluid transport is fixedly attached to the chamber wall of the processing chamber, between the plasma source and the sample support.