The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Jun. 29, 2012
Applicants:

Kyung IL Park, Anyang-si, KR;

Keun-ik Jeon, Cheonan-si, KR;

Sang-su Kim, Yongin-si, KR;

Youn-yong Lee, Asan-si, KR;

Inventors:

Kyung Il Park, Anyang-si, KR;

Keun-Ik Jeon, Cheonan-si, KR;

Sang-Su Kim, Yongin-si, KR;

Youn-Yong Lee, Asan-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/24 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3407 (2013.01); H01J 37/32522 (2013.01); H01J 37/3435 (2013.01); H01J 37/3497 (2013.01); Y10T 29/49947 (2015.01);
Abstract

A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.


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