The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Mar. 06, 2014
International Business Machines Corporation, Armonk, NY (US);
Mark C. Lamorey, Williston, VT (US);
Janak G. Patel, South Burlington, VT (US);
Peter Slota, Jr., Vestal, NY (US);
David B. Stone, Jericho, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Embodiments of the present invention disclose a semiconductor structure and method for increasing thermal dissipation in a three-dimensional integrated circuit package. In certain embodiments, the semiconductor structure comprises a logic die or a processor die attached to a substrate; a memory die stack attached to the logic die or the processor die; and a first lid attached to a first side of the logic or the processor die. The semiconductor structure further comprises a second lid attached to a second side of the memory die stack; a first heat sink attached to the first lid; and a second heat sink attached to the second lid.