The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Dec. 23, 2013
Applicant:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventor:

Wei-Shuo Su, Taoyuan, TW;

Assignee:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H05K 3/4614 (2013.01); H05K 3/4697 (2013.01); H05K 3/0097 (2013.01); H05K 3/4682 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1536 (2013.01);
Abstract

A substrate includes a first wiring substrate, a second wiring substrate, and an adhesive sheet. The first wiring substrate includes a number of first connecting pads and a first penetrating room. The second wiring substrate includes a number of second connecting pads. The adhesive sheet includes a number of through holes and a second penetrating room. The through holes are filled with a conducting material. The adhesive sheet and the first wiring substrate are orderly pressed on the second wiring substrate. The conducting material is connected to the first connecting pads and the second connecting pads. The first penetrating room of the first wiring substrate and the second penetrating room of the adhesive sheet cooperatively form a receiving recess.


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