The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Nov. 26, 2014
Applicants:
You GE, Tianjin, CN;
Meng Kong Lye, Shah Alam, MY;
Zhijie Wang, Tianjin, CN;
Inventors:
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/50 (2006.01); H01L 23/433 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 21/56 (2013.01);
Abstract
A packaged semiconductor device having an integrated circuit (IC) die, a flexible tube, and a metal slug. During assembly, a first end of the tube is mounted on a surface of the IC die and a second end of the tube extends away from the die surface. The exposed portions of the surface of the IC die are encased in a molding compound, which also encases the perimeter of the tube. After molding, the tube may be filled with metal to improve conduction of heat away from the die top. If the tube is formed of a soft material like rubber then the tube will not damage the die top during attachment thereto.