The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

May. 01, 2013
Applicant:

Soitec, Crolles, FR;

Inventors:

Walter Schwarzenbach, Saint Nazaire Les Eymes, FR;

Carine Duret, Grenoble, FR;

Francois Boedt, Meylan, FR;

Assignee:

SOITEC, Bernin, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/66 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); H01L 21/76251 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01);
Abstract

The invention relates to a process for treating a structure of semiconductor-on-insulator type successively comprising a support substrate, a dielectric layer and a semiconductor layer having a thickness of less than or equal to 100 nm, the semiconductor layer being covered with a sacrificial oxide layer, comprising measuring, at a plurality of points distributed over the surface of the structure, the thickness of the sacrificial oxide layer and of the semiconductor layer, so as to produce a mapping of the thickness of the semiconductor layer and to determine, from the measurements, the average thickness of the semiconductor layer, selective etching of the sacrificial oxide layer so as to expose the semiconductor layer, and carrying out a chemical etching of the semiconductor layer, the application, temperature and/or duration conditions of which are adjusted as a function of the mapping and/or of the mean thickness of the semiconductor layer, so as to thin, at least locally, the semiconductor layer by a thickness identified as being an overthickness at the end of the measurement step.


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