The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Sep. 14, 2012
Applicants:

Kazuhiro Yuasa, Toyama, JP;

Naonori Akae, Toyama, JP;

Masato Terasaki, Toyama, JP;

Inventors:

Kazuhiro Yuasa, Toyama, JP;

Naonori Akae, Toyama, JP;

Masato Terasaki, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/022 (2013.01); C23C 16/345 (2013.01); C23C 16/402 (2013.01); C23C 16/45529 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/0262 (2013.01); H01L 21/02164 (2013.01); H01L 21/02211 (2013.01); H01L 21/02532 (2013.01); H01L 21/67109 (2013.01);
Abstract

A semiconductor manufacturing method includes forming an oxide film on a substrate by performing a first cycle a predetermined number of times, including supplying a first source gas, an oxidizing gas and a reducing gas to the substrate heated to a first temperature in a process container under a sub-atmospheric pressure; forming a seed layer on a surface of the oxide film by supplying a nitriding gas to the substrate in the process container, the substrate being heated to a temperature equal to or higher than the first temperature and equal to or lower than a second temperature; and forming a nitride film on the seed layer formed on the surface of the oxide film by performing a second cycle a predetermined number of times, including supplying a second source gas and the nitriding gas to the substrate heated to the second temperature in the process container.

Published as:
US2013084712A1; KR20130035874A; CN103035485A; TW201318065A; JP2013084911A; KR101396253B1; TWI508174B; US9190264B2; CN103035485B; JP6042656B2;

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