The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Mar. 02, 2011
Yoichi Saito, Ayase, JP;
Shigeru Michiwaki, Ayase, JP;
Noriaki Taneko, Ayase, JP;
Shukichi Takii, Ayase, JP;
Yoichi Saito, Ayase, JP;
Shigeru Michiwaki, Ayase, JP;
Noriaki Taneko, Ayase, JP;
Shukichi Takii, Ayase, JP;
MEIKO ELECTRONICS CO., LTD., Ayase-shi, Kanagawa, JP;
Abstract
A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.