The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Jan. 15, 2014
Applicants:

Jang-gn Yun, Hwaseong-si, KR;

Hongsoo Kim, Seongnam-si, KR;

Aaron Park, Seoul, KR;

Hoosung Cho, Yongin-si, KR;

Inventors:

Jang-Gn Yun, Hwaseong-si, KR;

Hongsoo Kim, Seongnam-si, KR;

Aaron Park, Seoul, KR;

Hoosung Cho, Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1157 (2013.01); H01L 27/11575 (2013.01); H01L 27/11582 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Semiconductor devices are provided. A semiconductor device may include a substrate and a plurality of lines on the substrate. The semiconductor device may include a dielectric layer on the substrate and adjacent the plurality of lines. The semiconductor device may include a connection element in the dielectric layer. In some embodiments, the semiconductor device may include a plurality of contacts on the connection element, and a conductive interconnection on one of the plurality of contacts that are on the connection element and on a contact that is spaced apart from the connection element.


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