The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Nov. 12, 2013
Applicant:
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Inventor:
Atsushi Fujisawa, Nanae, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); B29C 45/14 (2006.01); B29C 45/00 (2006.01); H01L 23/02 (2006.01); H01L 23/31 (2006.01); B29C 45/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); B29C 45/0046 (2013.01); B29C 45/14655 (2013.01); H01L 21/565 (2013.01); H01L 23/02 (2013.01); H01L 23/49541 (2013.01); H01L 23/49544 (2013.01); H01L 23/49548 (2013.01); H01L 24/49 (2013.01); H01L 24/78 (2013.01); B29C 45/34 (2013.01); H01L 23/3107 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/3011 (2013.01);
Abstract
To provide a semiconductor device having suspension leads with less distortion. In QFN having a plurality of external terminal portions at the periphery of the bottom surface of a sealing body, a plurality of leads is linked to a plurality of long suspension leads of the QFN at an intermediate portion thereof or at between the intermediate portion and a position near the die pad. These long suspension leads are each supported by these leads, making it possible to suppress distortion of each of the suspension leads in a wire bonding step or molding step in the fabrication of the QFN.