Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant

Abstract

A semiconductor device has a semiconductor die disposed over the substrate. A conductive via is formed partially through the substrate. An encapsulant is deposited over the semiconductor die and substrate. An insulating layer is formed over the semiconductor die and encapsulant. The insulating layer includes an organic or inorganic insulating material. An adhesive layer is deposited over the insulating layer. The adhesive layer contacts only the insulating layer. A carrier is bonded to the adhesive layer. The insulating layer provides a single CTE across the entire bonding interface between the adhesive layer and semiconductor die and encapsulant. The constant CTE of the insulating layer reduces stress across the bonding interface. A portion of the substrate is removed by backgrinding to expose the conductive via. An insulating layer is formed over the substrate around the conductive via. An interconnect structure is formed over the conductive via.