The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Sep. 30, 2013
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;

Inventors:

Sung-Chun Yang, Hsinchu, TW;

Ying-Chi Peng, Zhudong Township, Hsinchu County, TW;

Yao-Pin Yang, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67369 (2013.01);
Abstract

Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.


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