The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Jan. 23, 2008
Applicants:

Shinji Togawa, Nagasaki, JP;

Ryosuke Ueda, Nagasaki, JP;

Inventors:

Shinji Togawa, Nagasaki, JP;

Ryosuke Ueda, Nagasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 15/00 (2006.01); C30B 29/06 (2006.01); C30B 13/28 (2006.01); C30B 13/32 (2006.01); C30B 15/22 (2006.01);
U.S. Cl.
CPC ...
C30B 29/06 (2013.01); C30B 13/285 (2013.01); C30B 13/32 (2013.01); C30B 15/22 (2013.01);
Abstract

Provided is a silicon crystalline material, which is manufactured by a CZ method to be used as a material bar for manufacturing a silicon single crystal by an FZ method and has a grasping section for being loaded in a crystal growing furnace employing the FZ method without requiring mechanical processing. A method for manufacturing such silicon crystalline material is also provided. The silicon crystalline material is manufactured by the silicon crystal manufacturing method employing the CZ method and is provided with the grasping section, which is manufactured in a similar way as a shoulder portion, a straight body portion and a tail portion in a silicon crystal growing step employing the CZ method, and is loaded in a single crystal manufacturing apparatus employing the FZ method to grow single crystals. A seed-crystal used in the silicon crystal manufacture employing the CZ method is used as the grasping section. The grasping section is manufactured by temporarily changing crystal growing conditions to form a protruding section or a recessed section on the outer circumference surface of the straight body section or by forming a dent on the shoulder portion of the straight body portion, at the time of manufacturing the silicon crystal by the CZ method.


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