The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Dec. 16, 2013
Applicant:

Sunedison Semiconductor Limited (Uen201334164h), St. Peters, MO (US);

Inventors:

Peter D. Albrecht, O'Fallon, MO (US);

Sumeet S. Bhagavat, St. Charles, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); B24B 7/22 (2006.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); B24B 37/08 (2012.01); B24B 37/12 (2012.01);
U.S. Cl.
CPC ...
B24B 7/228 (2013.01); B24B 37/08 (2013.01); B24B 37/12 (2013.01); H01L 21/30625 (2013.01); H01L 22/12 (2013.01);
Abstract

A platen for polishing a surface of a wafer has a reaction plate, a polishing plate, and a bladder. The reaction plate has a top and bottom surface, and defines a longitudinal axis. The polishing plate is positioned coaxially with the reaction plate. The polishing plate has a second top surface and a second bottom surface. The second top surface is adjacent to the bottom surface of the reaction plate. The bladder is coaxially located along a radially outer portion of either the top or bottom surface of the reaction plate. The bladder is connected with the polishing plate and able to expand to deform the polishing plate with respect to the bottom surface of the reaction plate.


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