The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Dec. 04, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Yosuke Akimoto, Tokyo, JP;

Akihiro Kojima, Kanagawa-ken, JP;

Miyoko Shimada, Kanagawa-ken, JP;

Hideyuki Tomizawa, Kanagawa-ken, JP;

Yoshiaki Sugizaki, Kanagawa-ken, JP;

Hideto Furuyama, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/50 (2010.01); H01L 33/44 (2010.01); H01L 33/00 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 33/0008 (2013.01); H01L 33/0075 (2013.01); H01L 33/44 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01);
Abstract

According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a fluorescent material layer and a scattering layer. The semiconductor layer has a first surface and a second surface on an opposite side to the first surface and includes a light emitting layer. The p-side electrode and the n-side electrode are provided on the semiconductor layer on a side of the second surface. The fluorescent material layer is provided on a side of the first surface and includes a plurality of fluorescent materials and a first bonding material. The first bonding material integrates the fluorescent materials. The scattering layer is provided on the fluorescent material layer and includes scattering materials and a second bonding material. The scattering materials are configured to scatter radiated light of the light emitting layer. The second bonding material integrates the scattering materials.


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