The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Feb. 15, 2013
Renesas Electronics Corporation, Kanagawa, JP;
Takuya Nakajo, Kanagawa, JP;
Masaki Tamura, Kanagawa, JP;
Yasushi Takahashi, Kanagawa, JP;
Keiichi Okawa, Kanagawa, JP;
Ryoichi Kajiwara, Hitachi, JP;
Sigehisa Motowaki, Mito, JP;
Hiroshi Hozouji, Hitachiota, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
Conventional surface roughening plating technology cannot always improve the adhesion between a leadframe and a plating film and it depends on the material used for surface roughening plating. Conventional surface roughening technology by etching can only be used for leadframes made of limited materials. Improved adhesion cannot therefore be achieved between a metal member such as leadframe and a sealing resin. A manufacturing method of a semiconductor device according to one embodiment is to carry out resin sealing using a metal member such as leadframe which has been subjected to alloying treatment of a base material and Zn plated on the surface thereof.