The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jun. 11, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Banqiu Wu, San Jose, CA (US);

Ajay Kumar, Cupertino, CA (US);

Leonid Dorf, San Jose, CA (US);

Shahid Rauf, Pleasanton, CA (US);

Kartik Ramaswamy, San Jose, CA (US);

Omkaram Nalamasu, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/027 (2006.01); G03F 7/004 (2006.01); G03F 7/00 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31138 (2013.01); G03F 7/00 (2013.01); H01L 21/0273 (2013.01); G03F 7/004 (2013.01); G03F 7/0035 (2013.01); H01J 37/3233 (2013.01); H01J 37/3266 (2013.01); H01J 37/32091 (2013.01);
Abstract

Methods for reducing the line width roughness on a photoresist pattern are provided herein. In some embodiments, a method of processing a patterned photoresist layer disposed atop a substrate includes flowing a process gas into a processing volume of a process chamber having the substrate disposed therein; forming a plasma within the process chamber from the process gas, wherein the plasma has a ion energy of about 1 eV to about 10 eV; and etching the patterned photoresist layer with species from the plasma to at least one of smooth a line width roughness of a sidewall of the patterned photoresist layer or remove debris.


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