The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Dec. 06, 2012
Applicant:

Tokuyama Corporation, Yamaguchi, JP;

Inventors:

Hideki Umekawa, Tsukuba, JP;

Shinji Matsui, Himeji, JP;

Shinya Omoto, Settsu, JP;

Assignee:

Tokuyama Corporation, Yamaguchi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/308 (2006.01); G03F 7/00 (2006.01); H01L 31/0236 (2006.01); G03F 7/004 (2006.01); G03F 7/027 (2006.01); G03F 7/075 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01L 21/3081 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); G03F 7/0047 (2013.01); G03F 7/027 (2013.01); G03F 7/0757 (2013.01); H01L 21/3085 (2013.01); H01L 31/02363 (2013.01); Y02E 10/50 (2013.01);
Abstract

The present invention provides a method for manufacturing a silicon substrate having texture structure, by which, in comparison with conventional methods, it is possible to reduce manufacturing step and form easily regular texture structure on silicon substrate surface. The method of the present invention comprises the steps of: (A) forming a pattern on the silicon substrate using a resin-comprising composition; (B) irradiating an etching gas to the silicon substrate surface other than the pattern portion; and (C) processing the silicon substrate irradiated with the etching gas with an alkaline etching fluid to form concave structure under the pattern portion. Furthermore, the present invention provides a resin-comprising composition usable in the method, in particular, a composition comprising photo-curable resin.


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