The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Jan. 27, 2012
Applicant:
Hin Yiu Anthony Chung, Elchingen, DE;
Inventor:
Hin Yiu Anthony Chung, Elchingen, DE;
Assignee:
Carl Zeiss SMT GmbH, Oberkochen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/52 (2006.01); G03B 27/68 (2006.01); G03F 7/20 (2006.01); B29D 11/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G02B 7/00 (2006.01); G03F 1/00 (2012.01); G03F 1/24 (2012.01); G03F 1/38 (2012.01);
U.S. Cl.
CPC ...
G03F 7/70916 (2013.01); B29D 11/0073 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G02B 7/00 (2013.01); G03F 1/14 (2013.01); G03F 1/24 (2013.01); G03F 1/38 (2013.01); G03F 7/70783 (2013.01); G03F 7/70808 (2013.01); G03F 7/70825 (2013.01); G03F 7/70841 (2013.01); G21K 2201/067 (2013.01); Y10T 156/10 (2015.01);
Abstract
To improve the bonding of two parts () of a component () of an EUV or UV lithography apparatus such that the probability of occurrence of additional stress over time in the bonded parts () is lessened, a component () of an EUV or UV lithography apparatus comprising two parts () bonded to each other by adhesive material () is proposed, wherein the adhesive material () is coated with a protective layer () insulating the adhesive material () from the surrounding gas environment.