The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Dec. 14, 2012
Applicants:

Dong Chen, Tucson, AZ (US);

Mark Munch, Tucson, AZ (US);

Inventors:

Dong Chen, Tucson, AZ (US);

Mark Munch, Tucson, AZ (US);

Assignee:

BRUKER NANO INC., Santa Barbara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/00 (2006.01); G01R 1/067 (2006.01); G01R 31/44 (2006.01); G01R 31/26 (2014.01); G01R 31/02 (2006.01); G09G 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06761 (2013.01); G01R 3/00 (2013.01); G01R 31/025 (2013.01); G01R 31/2635 (2013.01); G01R 31/44 (2013.01); G09G 3/006 (2013.01);
Abstract

A conductive probe for semiconductor material characterization includes a distal metallic layer of micrometer-size particles, an intermediate layer of conformable conductive elastomer material, and a pin attached to the elastomer layer. The probe is preferably manufactured by filling a recess in a bottom plate with the metallic particles, coupling a top plate thereto with a perforation aligned with the recess, and filling the perforation with uncured conductive elastomer. The pin, preferably spring-loaded, is pressed into the perforation to compress the silicone to its intended probe size. The silicone is then allowed to cure at room temperature or in a heated environment, or both.


Find Patent Forward Citations

Loading…