The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Mar. 29, 2013
Applicant:

Stmicroelectronics Pte Ltd., Singapore, SG;

Inventors:

Olivier Le Neel, Singapore, SG;

Ravi Shankar, Singapore, SG;

Suman Cherian, Singapore, SG;

Calvin Leung, Singapore, SG;

Tien-Choy Loh, Singapore, SG;

Shian-Yeu Kam, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/058 (2006.01); G01N 27/22 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); G01L 9/12 (2006.01); G01K 7/01 (2006.01); H01L 27/02 (2006.01); H01L 29/78 (2006.01); G01K 7/18 (2006.01); G01K 7/20 (2006.01);
U.S. Cl.
CPC ...
G01N 27/223 (2013.01); G01K 7/01 (2013.01); G01K 7/186 (2013.01); G01K 7/20 (2013.01); G01L 9/12 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 27/0248 (2013.01); H01L 29/7804 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.


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