The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Sep. 28, 2012
Applicant:
Advanced Technology Materials, Inc., Danbury, CT (US);
Inventors:
Tsutomu Kojima, Kyoto, JP;
Yukichi Koji, Shiga-ken, JP;
Assignee:
ADVANCED TECHNOLOGY MATERIALS, INC., Danbury, CT (US);
Primary Examiner:
Int. Cl.
CPC ...
C23F 3/00 (2006.01); C23F 1/18 (2006.01); H01L 21/3213 (2006.01); C23F 1/34 (2006.01); C23F 1/44 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
C23F 1/18 (2013.01); C23F 1/34 (2013.01); C23F 1/44 (2013.01); H01L 21/32134 (2013.01); H01L 24/03 (2013.01); H01L 21/76865 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03826 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1461 (2013.01);
Abstract
Object is to provide an etching solution which generates less foam and can etch copper or copper alloy at high selectivity when used in a step of etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel. The etching solution to be used in a step of selectively etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel has, as essential components thereof, (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide.