The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jun. 20, 2014
Applicants:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Stmicroelectronics, Inc., Coppell, TX (US);

Inventors:

Daniele Prati, Catania, IT;

Domenico Giusti, Monza, IT;

Simon Dodd, West Linn, OR (US);

Assignees:

STMicroelectronics S.r.l., Agrate Brianza, IL;

STMicroelectronics, Inc., Coppell, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14427 (2013.01); B41J 2/1408 (2013.01); B41J 2/14112 (2013.01); B41J 2/1648 (2013.01);
Abstract

The present disclosure is directed to a microfluidic die having a substrate with an inlet path that is configured to move fluid into the die. The die includes a plurality of heaters formed above the substrate, each heater having a first area, a plurality of chambers formed above the plurality of heaters, and a plurality of nozzles formed above the chambers. Each nozzle having an entrance adjacent to the chamber and an exit adjacent to en external environment, the entrance having a second area, and the second having a third area, the first area being greater than the second area, and the second area being greater than the third area. A ratio of the first area to the third area being greater than 5 to 1.


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