The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Jun. 03, 2013
Siltronic Ag, Munich, DE;
Albert Blank, Obing, DE;
SILTRONIC AG, Munich, DE;
Abstract
A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip includes executing a relative movement between the workpiece and a wire gang of a wire saw with the aid of a forward feed device with a defined forward feed rate so as to slice the wafers. The forward feed rate is varied through the course of the method and includes being set to a value vat a cutting depth of 50% of the workpiece diameter. Subsequently, the forward feed rate is to a value v>1.15×vas the forward feed rate passes through a local maximum. The forward feed rate is set to a value v<vwhen the wire gang first comes into contact with the sawing strip. The forward feed rate is increased to a value v>v.